Additive Manufacturing

The key feature of our AM technology is solid-state SMAM that uses high-intensity, focused, ultrasonic energy to bond dissimilar materials through instantaneous atomic diffusion without a melting or liquefying process. Our technology is scalable; the dimensions of a single point (or voxel) can be fine-tuned from the micron to centimeter-scale, depending on target applications. Our product's capability of voxel-by-voxel or strip-by-stripe bonding of dissimilar materials (e.g., copper foil on a polymer) has prompted us to develop a new PCB AM technology.