Posts by interlog

September 2017

Interlog Corporation has been awarded a research programs from the Missile Defense Agency (MDA) to develop Universal Additive Manufacturing Packaging (UAMP) process that provides ultrafine die-packaging not only for old packaging (QFP/PGA/BGA) but also new packaging types (FCBGA/WLSCP, 3DIC, etc.) on a single additive manufacturing platform.

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April 2017

Interlog Corporation has been awarded a research programs from the Navy to develop Hybrid In-Process Additive Manufacturing for Sonobuoy (HIPAMS) that enables the Navy to have a on-demand sonobuoy manufacturing capability with a nondestructive evaluation (NDE) capability.

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October 2016

Interlog Corporation has been awarded a research programs from the Defense Logistics Agency (DLA) to develop Hybridized Additive Manufacturing for Medical Equipment (HAMME) Technology that enables military logistic units to build multiple medical material equipment/supplies in a single 3D printing platform.

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